{"product_id":"ge-fanuc-ic695chs012-chassis-racks-pacsystems-rx3i","title":"GE Fanuc IC695CHS012 Chassis Racks PACSystems RX3i","description":"\u003cp\u003eThe \u003cstrong\u003eGE Fanuc IC695CHS012\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eIC695CHS012\u003c\/strong\u003e Chassis Baseplate, operates as a dedicated hardware component for mechanical retention and physical backplane routing within PACSystems RX3i controller assemblies.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC695CHS012\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc \/ Emerson\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUnited States\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e1.45 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e441 mm x 131 mm x 141 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0-60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003ePassive bus hardware; supports up to 30 A continuous power distribution\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTotal Slots\u003c\/td\u003e\n\u003ctd\u003e12 physical module slots\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBus Architecture\u003c\/td\u003e\n\u003ctd\u003eDual-bus layout supporting both PCI and serial expansion tracks\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGrounding Provisions\u003c\/td\u003e\n\u003ctd\u003eDual M4 earth grounding terminal studs\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMounting Orientation\u003c\/td\u003e\n\u003ctd\u003eHorizontal panel mounting or standard 35 mm DIN-rail attachment\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Bus Communication Velocity and Density Scaling\u003c\/h3\u003e\n\u003cp\u003eThe module structural framework incorporates an integrated high-density dual-bus backplane logic board designed to maximize backplane bus communication velocity across all 12 operational slots. The internal physical tracking supports high-speed PCI networks alongside serial infrastructure paths on a single substrate layer. This design handles simultaneous dynamic processing loops without introducing timing jitter or trace noise. The chassis baseplate facilitates massive module configuration variations, allowing extensive I\/O density scaling options for diverse hardware setups while maintaining strict firmware flash compatibility parameters across legacy and contemporary PACSystems RX3i components linked to Profinet or EtherNet\/IP deterministic networks.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Does the IC695CHS012 dual-bus backplane layout support hot-swapping for all connected modules?\u003c\/p\u003e\n\u003cp\u003eA: The backplane infrastructure allows online insertion and removal (hot-swapping) for peripheral discrete and analog I\/O modules when executing alongside an active processor loop. However, central processing units (CPUs) and primary power supply units do not support hot-swapping and require complete input line isolation before hardware replacement.\u003c\/p\u003e\n\u003cp\u003eQ: How is the physical electrical load balanced across the internal power rails of this 12-slot chassis?\u003c\/p\u003e\n\u003cp\u003eA: The power distribution traces distribute dual current rails directly from the power supply modules inserted in the dedicated left-hand slots. The system permits the synchronization of multiple power modules in a single baseplate to execute parallel load balancing or provide structured hardware power redundancy configurations.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eSecure the assembly to the rear cabinet panel using four standard M5 structural screws or clamp the integrated retaining clips firmly onto standard symmetric 35 mm DIN rails.\u003c\/li\u003e\n\u003cli\u003eConnect a heavy-gauge copper grounding wire or braided strap from the local M4 earth studs directly to the primary system enclosure enclosure grounding busbar.\u003c\/li\u003e\n\u003cli\u003ePreserve a mandatory clearance boundary space of 102 mm at the top and bottom edges of the backplane body shell to ensure non-obstructed convective thermal dissipation.\u003c\/li\u003e\n\u003cli\u003eAvoid routing external high-voltage 415 VAC power conductors directly across or under the exposed rear printed circuit board casing of the baseplate assembly.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":53567302238392,"sku":"IC695CHS012","price":99.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0935\/6132\/3704\/files\/IC695CHS012_1_1.jpg?v=1780968148","url":"https:\/\/www.globalpetroparts.com\/products\/ge-fanuc-ic695chs012-chassis-racks-pacsystems-rx3i","provider":"Global Petro Parts Automation","version":"1.0","type":"link"}