{"product_id":"i-o-module-carriers-ge-versamax-ic200chs005","title":"I\/O Module Carriers GE VersaMax IC200CHS005","description":"\u003cp\u003eThe \u003cstrong\u003eGE IC200CHS005\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eIC200CHS005\u003c\/strong\u003e Compact I\/O Carrier, operates as a dedicated hardware component for mechanical support and electrical backplane interface execution within VersaMax Distributed I\/O systems. The module establishes direct structural termination and signal routing path links for field wiring and hot-swappable functional input\/output blocks.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC200CHS005\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE (Emerson)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eModule Type\u003c\/td\u003e\n\u003ctd\u003eCompact I\/O Carrier\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTerminal Type\u003c\/td\u003e\n\u003ctd\u003eFixed barrier-style screw terminals\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eNumber of Terminals\u003c\/td\u003e\n\u003ctd\u003e36 points\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWire Size Accommodated\u003c\/td\u003e\n\u003ctd\u003e14 AWG to 30 AWG (solid or stranded copper wire)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVoltage Rating\u003c\/td\u003e\n\u003ctd\u003eUp to 264 VAC \/ 125 VDC isolation boundaries\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCurrent Rating\u003c\/td\u003e\n\u003ctd\u003e2 A maximum per terminal point\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003ePassive hardware element (0 W draw)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eStorage Temp\u003c\/td\u003e\n\u003ctd\u003e-40 to 85 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.18 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e110 mm x 67 mm x 50 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCore Performance Indicators\u003c\/td\u003e\n\u003ctd\u003e1500 VAC isolation barrier, zero-backplane communication latency\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eI\/O Density Scaling and Firmware Flash Compatibility\u003c\/h3\u003e\n\u003cp\u003eThis base mounting card cage architecture coordinates electrical communication routing to govern backplane bus communication velocity across the internal module busway. It enables targeted I\/O density scaling by supporting a wide selection of discrete or analog signal blocks inside a single DIN-rail allocation layout. The carrier relies completely on passive electrical path links, leaving execution timing metrics up to the network interface unit firmware flash compatibility layer to align physical multi-drop I\/O tracking loops without logic sweep drift or network synchronization dropouts.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Does the physical configuration of the IC200CHS005 allow active hot-swap module replacement while the rack assembly is energized?\u003c\/p\u003e\n\u003cp\u003eA: Yes. The base unit isolates backplane bus pins structurally from the active field wiring channels. A functional I\/O block can be decoupled or inserted onto this carrier while system power remains active, provided field wiring current is within safe threshold limits.\u003c\/p\u003e\n\u003cp\u003eQ: How is common potential grouping established on the 36-point terminal assembly?\u003c\/p\u003e\n\u003cp\u003eA: The passive backplane pathways segment the field contacts into isolated groups. Bridging connections requires inserting external physical bus bars or jumpers directly into the designated barrier-style screw positions to map out a single voltage reference loop.\u003c\/p\u003e\n\u003cp\u003eQ: What actions prevent mechanical connector pin misalignment during module mating loops?\u003c\/p\u003e\n\u003cp\u003eA: The structural frame utilizes mechanical guide tracks that align the processing block connector with the internal carrier socket interface before contact engagement occurs, keeping the pins aligned and protecting the backplane traces.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eMechanical Assembly Anchorage\u003c\/strong\u003e: Mount the carrier structure vertically onto standard 35 mm DIN rails. Ensure the upper rail hooks snap securely and verify the integrated alignment locking mechanism engages firmly into the adjacent unit.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eConductor Wire Preparation Metric\u003c\/strong\u003e: Strip the outer jacket of the field conductors back by exactly 6 mm. Seat the bare copper section fully within the barrier clamping assembly to verify that no live trace remains exposed.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTerminal Screw Tightening Torque\u003c\/strong\u003e: Secure all field wiring termination points by driving the integrated barrier screws down to a fixed specification of 0.5 Nm to prevent thermal micro-arcing.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLoop Routing Layout Segregation\u003c\/strong\u003e: Run low-voltage instrumentation loop lines and data paths inside separate wire duct pathways isolated by a minimum distance of 10 cm from inductive high-voltage AC motor lines.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":53580746948792,"sku":"IC200CHS005","price":99.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0935\/6132\/3704\/files\/IC200CHS005_2.jpg?v=1781143636","url":"https:\/\/www.globalpetroparts.com\/products\/i-o-module-carriers-ge-versamax-ic200chs005","provider":"Global Petro Parts Automation","version":"1.0","type":"link"}