{"product_id":"ic200chs025-terminal-carriers-ge-versamax","title":"IC200CHS025 Terminal Carriers GE VersaMax","description":"\u003cp\u003eThe \u003cstrong\u003eGE IC200CHS025\u003c\/strong\u003e serves as the primary \u003cstrong\u003eIC200CHS025\u003c\/strong\u003e Base Carrier utilized to execute local physical and electrical connection tasks across VersaMax I\/O platforms. The device operates as a dedicated structural mounting base that anchors a single input\/output module while providing spring-style terminal attachment points for external field instrumentation cables. It establishes continuous low-resistance electrical pathways linking the processing logic unit to the backplane bus data lines through integrated multi-pin connector sockets.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC200CHS025\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUnited States\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.21 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e66.8 mm x 128 mm x 59.5 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003ePassive hardware element (0 mA from backplane)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTerminal Type\u003c\/td\u003e\n\u003ctd\u003eSpring-clamp terminal strip\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWire Gauge Capacity\u003c\/td\u003e\n\u003ctd\u003e14 AWG to 22 AWG solid or stranded conductors\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eNumber of Terminals\u003c\/td\u003e\n\u003ctd\u003e36 I\/O points and 2 internal bus connectors\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Bus Communication Velocity\u003c\/h3\u003e\n\u003cp\u003eThis backplane assembly structure supports continuous localized transmission arrays without introducing impedance shifts that degrade backplane bus communication velocity. The mechanical tracking rails align the adjacent expansion nodes to enforce uniform contact pressure across the logic pins, preventing transport noise over the shared system backplane layout. Integrated configuration paths ensure permanent firmware flash compatibility and uninterrupted data validation when implementing extensive I\/O density scaling options on the DIN-rail stack.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Does the IC200CHS025 base carrier assembly support hot-swap replacement of the upper I\/O module?\u003c\/p\u003e\n\u003cp\u003eA: Yes, specific electronic modules mounted onto this carrier can be hot-swapped if the individual module architecture accommodates live extraction. However, the IC200CHS025 base unit itself cannot be detached from the DIN-rail stack or separated from adjacent carriers while the node power supply is energized.\u003c\/p\u003e\n\u003cp\u003eQ: What are the engineering advantages of the spring-clamp terminals on this carrier over screw-type blocks?\u003c\/p\u003e\n\u003cp\u003eA: The spring-clamp mechanism provides continuous physical tension on the conductor wire, which prevents terminal loosening caused by field vibration profiles and eliminates repetitive torque validation steps.\u003c\/p\u003e\n\u003cp\u003eQ: What action is triggered if the interlocking side bus connectors are misaligned during deployment?\u003c\/p\u003e\n\u003cp\u003eA: Misalignment interrupts the continuity of the local serial backplane bus plane, causing the main controller or network interface unit to flag a missing module fault and cease local node I\/O execution.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cp\u003eMount the terminal carrier vertically onto an approved 35 mm DIN-rail path inside the enclosure panel. Slide the housing along the rail until the side male-female bus pins lock firmly into the adjacent VersaMax unit to preserve backplane bus line continuity. Insert stripped field wires directly into the spring-clamp terminal points using a standard slotted tool to depress the clamp mechanism, ensuring no loose strands remain external to the block. Maintain at least 50 mm of open boundary clearance above and below the carrier margins to promote effective convective thermal air current distribution across the complete node system.\u003c\/p\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":53596318269624,"sku":"IC200CHS025","price":99.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0935\/6132\/3704\/files\/IC200CHS025_2.jpg?v=1781600928","url":"https:\/\/www.globalpetroparts.com\/products\/ic200chs025-terminal-carriers-ge-versamax","provider":"Global Petro Parts Automation","version":"1.0","type":"link"}