{"product_id":"ic694mdl752-ge-fanuc-digital-i-o-cards-pacsystems-rx3i","title":"IC694MDL752 GE Fanuc Digital I\/O Cards PACSystems RX3i","description":"\u003ch3\u003eProduct Overview\u003c\/h3\u003e\n\u003cp\u003eThe \u003cstrong\u003eGE Fanuc IC694MDL752\u003c\/strong\u003e serves as the primary \u003cstrong\u003eIC694MDL752\u003c\/strong\u003e Digital Output Module utilized to execute discrete electronic switching tasks across PACSystems RX3i platforms. The hardware commands external physical actuators by transferring digital control bits from the primary backplane logic bus to 32 independent, current-sinking solid-state output circuits.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC694MDL752\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc (Emerson Automation)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUnited States\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.18 kg (0.40 lbs)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e130 x 140 x 31 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e260 mA maximum at +5 VDC (from backplane bus)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOutput Type\u003c\/td\u003e\n\u003ctd\u003e24 VDC Electronic Sinking (Negative Logic)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eNumber of Channels\u003c\/td\u003e\n\u003ctd\u003e32 channels (arranged in 4 isolated groups of 8 channels each)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Voltage Range\u003c\/td\u003e\n\u003ctd\u003e12 to 24 VDC nominal (10.2 to 30 VDC absolute boundaries)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOutput Current Rating\u003c\/td\u003e\n\u003ctd\u003e0.5 A maximum per channel (3.0 A maximum per group at 60 deg C)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInrush Current\u003c\/td\u003e\n\u003ctd\u003e2.0 A maximum peak for 10 ms duration\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eResponse Time\u003c\/td\u003e\n\u003ctd\u003e0.5 ms maximum from logic command to physical output state shift\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eIsolation Voltage\u003c\/td\u003e\n\u003ctd\u003e1500 VAC continuous between terminal block and backplane logic\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eDeterministic Networks \u0026amp; I\/O Density Scaling\u003c\/h3\u003e\n\u003cp\u003eThe electronic module employs high-density terminal assignments to maximize physical I\/O density scaling options within a single chassis slot footprint. The logic component maps output memory arrays directly to the controller matrix, executing synchronous runtime states without internal trace latency. Internal micro-circuitry ensures strict firmware flash compatibility parameters are upheld, allowing accurate channel diagnostics to pass continuously through peripheral network drops communicating via Profinet \/ EtherNet\/IP deterministic networks.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: How is circuit protection configured for individual channels on the IC694MDL752 module?\u003c\/p\u003e\n\u003cp\u003eA: The module does not incorporate internal electronic fusing for individual channels. To prevent permanent hardware destruction caused by field wire short-circuits or excessive electrical loads, external fast-acting fuses must be installed on each direct current input loop.\u003c\/p\u003e\n\u003cp\u003eQ: What is the mechanical limitation regarding hot-swap extraction for this specific digital card?\u003c\/p\u003e\n\u003cp\u003eA: The hardware architecture supports hot-swapping under chassis backplane power on RX3i Universal Backplanes (IC695 models). The terminal block assembly can be removed from the module faceplate without disrupting power routing to surrounding active I\/O cards.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eChassis Attachment\u003c\/strong\u003e: Verify all upstream electrical supply loops are isolated. Align the rear guide teeth of the module with the selected slot tracks on the RX3i baseplate. Push the assembly backward until the bottom latch snap locks onto the lower chassis profile.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTerminal Block Wiring\u003c\/strong\u003e: Use a high-density 36-pin terminal block assembly. Route field wiring into the pressure-plate terminals, stripping insulation back exactly 6 mm. Tighten terminal screws to a maximum specification of 0.56 Nm (5 in-lbs).\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCommon Power Grouping\u003c\/strong\u003e: Connect the external direct current supply ground return lines directly to the group common terminals (pins 9, 18, 27, and 36). Separate the four distinct groups if electrical isolation between discrete panel zones is required.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eConductor Separation Rules\u003c\/strong\u003e: Run the low-voltage DC output lines through dedicated panel wire trays. Maintain spatial division from high-power three-phase AC motor conductors to eliminate induced transient voltage spikes across the solid-state switches.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":53518874280120,"sku":"IC694MDL752","price":99.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0935\/6132\/3704\/files\/IC694MDL752_3.jpg?v=1779961309","url":"https:\/\/www.globalpetroparts.com\/products\/ic694mdl752-ge-fanuc-digital-i-o-cards-pacsystems-rx3i","provider":"Global Petro Parts Automation","version":"1.0","type":"link"}