{"product_id":"ic697acc724-series-90-70-blank-slot-filler-module-ge-fanuc","title":"IC697ACC724 Series 90-70 Blank Slot Filler Module GE Fanuc","description":"\u003ch3\u003eProduct Overview\u003c\/h3\u003e\n\u003cp\u003eThe \u003cstrong\u003eGE Fanuc IC697ACC724\u003c\/strong\u003e serves as the primary \u003cstrong\u003eIC697ACC724\u003c\/strong\u003e Blank Slot Filler Module utilized to execute physical rack space management across Series 90-70 platforms. This structural component seals unpopulated slots within standard 90-70 chassis enclosures, forming an uninterrupted front barrier across the card cage. It establishes proper internal convective airflow vectors and prevents foreign particulate contamination from accumulating directly onto the exposed circuits of active backplane channels.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003ctable\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"1\"\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd data-row=\"1\"\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"2\"\u003eModel\u003c\/td\u003e\n\u003ctd data-row=\"2\"\u003eIC697ACC724\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"3\"\u003eBrand\u003c\/td\u003e\n\u003ctd data-row=\"3\"\u003eGE Fanuc (Series 90-70)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"4\"\u003eModule Type\u003c\/td\u003e\n\u003ctd data-row=\"4\"\u003eBlank Slot Filler Module\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"5\"\u003eOrigin\u003c\/td\u003e\n\u003ctd data-row=\"5\"\u003eUnited States\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"6\"\u003eWeight\u003c\/td\u003e\n\u003ctd data-row=\"6\"\u003e0.23 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"7\"\u003eDimensions\u003c\/td\u003e\n\u003ctd data-row=\"7\"\u003e5.0 cm x 26.4 cm x 19.8 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"8\"\u003eOperating Temp\u003c\/td\u003e\n\u003ctd data-row=\"8\"\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"9\"\u003ePower Consumption\u003c\/td\u003e\n\u003ctd data-row=\"9\"\u003eNone (Passive Mechanical Component)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"10\"\u003eSlot Width\u003c\/td\u003e\n\u003ctd data-row=\"10\"\u003eDouble Slot (2 slot width allocation)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"11\"\u003eEnclosure Material\u003c\/td\u003e\n\u003ctd data-row=\"11\"\u003eHeavy-gauge sheet metal with polymer front faceplate\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"12\"\u003eSubsystem Compatibility\u003c\/td\u003e\n\u003ctd data-row=\"12\"\u003eSeries 90-70 Standard and Extended Racks\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch3\u003eCooling Optimization and I\/O Density Scaling\u003c\/h3\u003e\n\u003cp\u003eThe installation of this double-width structural module regulates internal thermal pressure profiles during extensive I\/O density scaling adjustments. When a double-slot gap remains unsealed, the open area alters vertical thermal convection paths, causing forced cooling air to bypass adjacent microprocessors. Inserting this block maintains designed internal static pressure constraints, preventing localized hotspots on surrounding high-performance modules and ensuring uninterrupted firmware flash compatibility across the active hardware backplane.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Does this component draw logic current from the 5 VDC backplane pins or generate any thermal output?\u003c\/p\u003e\n\u003cp\u003eA: No. The assembly is entirely passive and mechanical, containing no circuit boards, internal logic wiring, or physical backplane connectors. It draws zero milliamperes from the power supply bus.\u003c\/p\u003e\n\u003cp\u003eQ: Is it permissible to remove or insert this filler module while the Series 90-70 rack remains energized?\u003c\/p\u003e\n\u003cp\u003eA: Yes. Because the component features no electrical conductor interfaces or signal pathways, physical manipulation of this mechanical plate does not generate electrical noise or disrupt live backplane bus communication cycles.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eChassis Alignment\u003c\/strong\u003e: Position the upper and lower injection-molded alignment guides of the filler module into the corresponding slot tracks of the empty double-width chassis space.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMechanical Seating\u003c\/strong\u003e: Slide the module backward into the card cage until the front faceplate lines up flush with adjacent units. Hand-tighten the top and bottom retention screws directly into the rack frame to prevent vibration displacement.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThermal Maintenance\u003c\/strong\u003e: Ensure all unused slot positions inside the chassis are occupied by single or double-width filler plates to prevent ambient air bypass and safeguard components against unattenuated electrostatic discharge.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":53512221262008,"sku":"IC697ACC724","price":99.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0935\/6132\/3704\/files\/IC697ACC722_1_75f71638-8df2-4f8d-b875-8ad054ecb61a.jpg?v=1779786596","url":"https:\/\/www.globalpetroparts.com\/products\/ic697acc724-series-90-70-blank-slot-filler-module-ge-fanuc","provider":"Global Petro Parts Automation","version":"1.0","type":"link"}