{"product_id":"is200wnpsh1a-ge-speedtronic-mark-vi-power-supply-daughterboard","title":"IS200WNPSH1A | GE | Speedtronic Mark VI Power Supply Daughterboard","description":"\u003ch3\u003eProduct Overview\u003c\/h3\u003e\n\u003cp\u003eThe GE IS200WNPSH1A operates as a highly specialized Power Supply Daughterboard (WNPS) within the General Electric Speedtronic Mark VI gas and steam turbine control architecture. This critical power sub-module mounts directly onto a primary host board or power distribution backplane to provide localized voltage regulation, filtering, and isolation. It conditions incoming bulk DC power and establishes clean, stable low-voltage rails required by sensitive microprocessor circuits and input\/output channels. Integrating this Brand New, original GE daughterboard prevents voltage ripple, stabilizes computational clock cycles, and eliminates unexpected processor resets caused by erratic cabinet power fluctuation.\u003c\/p\u003e\n\u003ch3\u003eTechnical Specifications\u003c\/h3\u003e\n\u003cp\u003eThe table below displays the electrical parameters, interface mechanics, and thermal constraints of the IS200WNPSH1A daughterboard:\u003c\/p\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr class=\"firstRow\"\u003e\n\u003ctd\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cstrong\u003eTechnical Specification \/ Hardware Rating\u003c\/strong\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eManufacturer\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eGeneral Electric (GE)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eModel Number\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eIS200WNPSH1A (Alternates: IS200WNPSH1AAA)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eSystem Platform\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eSpeedtronic Mark VI\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eBoard Classification\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003ePower Supply Daughterboard \/ Sub-Module\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eCircuit Function\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eLocalized DC-to-DC conversion and signal conditioning\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eMounting Interface\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eHigh-density multi-pin header pins for host-board stacking\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eCooling Architecture\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eConvection cooling via optimized PCB thermal vias\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eOperating Temperature\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e0°C to +60°C (+32°F to +140°F)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eProtection Profile\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eOver-current suppression and transient voltage clamping\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch3\u003eEngineering Advantages\u003c\/h3\u003e\n\u003cp\u003eThe IS200WNPSH1A delivers clear mechanical and electrical solutions that solve high-density packaging challenges and noise vulnerabilities in turbine control enclosures:\u003c\/p\u003e\n\u003cul class=\"list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eVertical Space Optimization:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eThe modular daughterboard design stacks directly over the host printed circuit board via heavy-duty header pins, minimizing the overall surface footprint inside tightly packed VME control racks.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eLocalized Ripple Suppression:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eHigh-grade onboard solid-state capacitors filter out high-frequency electrical noise and switching ripples directly at the point of load, preventing signal corruption in adjacent analog I\/O lines.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eThermal Isolation Geometry:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eThe physical separation between the daughterboard and the host card creates an air gap channel, preventing concentrated thermal energy from migrating into vulnerable main processor components.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eHigh-Pin Security Coupling:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eIndustrial-grade multi-pin connectors maintain solid friction-fit physical contact under conditions of continuous low-frequency machinery vibration, preventing micro-arcing and intermittent power losses.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eFAQs\u003c\/h3\u003e\n\u003cul class=\"list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eWhat specific design configuration does the \"H1A\" suffix variant establish?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eThe \"H1A\" code indicates the first-generation hardware assembly revision, including specific component sourcing tolerances and physical trace layouts for the WNPS series. The expanded \"H1AAA\" designation represents the functional artwork and firmware revision track. This model maintains total compatibility with designated Mark VI power distribution networks. Always cross-check your active control rack hardware diagram inside GE ToolboxST before installing replacement sub-boards.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eCan technicians hot-swap the IS200WNPSH1A while the host board remains energized?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eNo. Removing or inserting this power daughterboard while live voltage passes through the backplane triggers severe electrical arcing across the header pins. This action destroys the delicate multi-pin connectors and damages processing chips on the host board. Power down the entire control rack sub-assembly completely before performing any hardware swap.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eHow should field engineers align the board during physical installation?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eField engineers must align all mating pins on the underside of the IS200WNPSH1A precisely with the corresponding female socket headers on the host board. Apply firm, even downward pressure across the edges of the card until it seats flat. Ensure no pins bend out of alignment, as a bent pin will break the voltage regulation loops and cause immediate power-up faults.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":53487128510648,"sku":"IS200WNPSH1A","price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0935\/6132\/3704\/files\/IS200WNPSH1ABA_1_e26aa788-005f-40de-b430-f86ccb62bff8.jpg?v=1779265719","url":"https:\/\/www.globalpetroparts.com\/products\/is200wnpsh1a-ge-speedtronic-mark-vi-power-supply-daughterboard","provider":"Global Petro Parts Automation","version":"1.0","type":"link"}