GE Fanuc
Digital Output Cards PACSystems RX3i IC694MDL916 GE Fanuc
Manufacturer: GE Fanuc
Product No.: IC694MDL916
Product Type: Digital Output Cards
Product Origin: USA
Payment:T/T, Western Union
Weight: 110g
Shipping port: Xiamen
Warranty: 12 months
Product Overview
Configured for high-density discrete switching loops in PACSystems RX3i networks, the GE Fanuc IC694MDL916 (IC694MDL916 Relay Output Module) provides direct physical/electrical execution. The component isolates internal control logic from external field loads, activating up to sixteen independent mechanical contact switches based on command states written across the central rack assembly.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC694MDL916 |
| Brand | GE Fanuc / Emerson |
| Origin | United States |
| Weight | 0.38 kg |
| Dimensions | 130 mm x 115 mm x 32 mm |
| Operating Temp | 0-60 deg C |
| Power Consumption | 150 mA at 5 VDC from backplane, 135 mA at 24 VDC relay coil power draw |
| Channels | 16 Form A (SPST) normally open relays |
| Output Voltage Range | 5-30 VDC, 5-250 VAC |
| Contact Current Rating | 4 A per point maximum (resistive load) |
| Isolation Voltage | 1500 V AC continuous channel-to-backplane logic |
Deterministic Network Backplane Bus Performance
The module interfaces with the controller chassis to execute digital commands down to the millisecond scale. It synchronizes mechanical coil responses with internal status registers, allowing clean contact closure matching with active system rungs. The processing circuitry maintains firmware flash compatibility profiles across mixed-module racks, supporting predictable I/O density scaling options alongside concurrent Profinet or EtherNet/IP deterministic networks without inducing bus processing latency or signal degradation.
Frequently Asked Questions
Q: Does the IC694MDL916 module support hot-swap component extraction or modification?
A: No. Complete electrical isolation of the RX3i system backplane rack must be executed prior to physical insertion or extraction of this unit. Attempting to swap the hardware while the backplane bus is actively energized can induce physical contact arcing or cause immediate diagnostic software execution drops on the master CPU.
Q: How is external inductive load protection managed on this relay hardware?
A: The module does not contain internal suppression networks across the dry mechanical contacts. External transient suppressors, such as reverse-biased diodes for DC circuits or RC snubber networks for AC circuits, must be wired across each individual field actuator to maximize contact lifespan and limit voltage spikes.
Field Installation Guidelines
- Insert the mechanical chassis firmly into the local or remote expansion rack slot, validating that the integrated module latches are completely seated on the retention rail.
- Route all low-voltage AC or DC discrete output control wiring within dedicated wire trays, keeping field runs isolated from heavy variable-frequency drive power trunks.
- Connect an external, regulated 24 VDC source to the designated terminal block pins to satisfy the power demands of the internal mechanical relay coils.
- Verify the total collective load current per module common terminal does not exceed the printed maximum backplane bus design constraints.
Return policy
We aim to provide reliable products and a smooth purchasing experience. If there is a problem with your order, please contact us and we will assist according to our Refund Policy.
Shipping
We provide international shipping options to meet different delivery requirements. Please review details regarding methods and timelines in our Shipping Policy.
Warranty
We provide a 12-month warranty for all products, subject to normal use and proper installation.
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