GE Fanuc
GE Fanuc IC695PSA140 Power Supply Modules PACSystems RX3i
Manufacturer: GE Fanuc
Product No.: IC695PSA140
Product Type: Power Supply Modules
Product Origin: USA
Payment:T/T, Western Union
Weight: 110g
Shipping port: Xiamen
Warranty: 12 months
Product Overview
Configured for multi-rail voltage regulation in RX3i PACSystems architectures, the GE Fanuc IC695CHS007, also cataloged as the IC695PSA140 Power Supply Module, provides direct physical/electrical execution. The component processes input source voltage to feed internal backplane rails, maintaining logical continuity across adjacent processor and input/output modules.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC695PSA140 |
| Brand | GE Fanuc / Emerson |
| Origin | United States |
| Weight | 0.91 kg |
| Dimensions | 140 mm x 135 mm x 35 mm |
| Operating Temp | 0-60 deg C |
| Power Consumption | 40 W internal output capacity max |
| Input Voltage Range | 85-264 VAC / 100-300 VDC |
| Outputs Supplied | 5.1 VDC, 3.3 VDC, and 24 VDC rails |
| Current Ratings | 5.1 VDC at 6 A / 3.3 VDC at 9 A |
Backplane Bus Communication Velocity and Redundancy Scaling
The module maps power health statistics directly onto the RX3i backplane bus layer, validating system infrastructure health in real time. It supports load-sharing configurations when integrated with parallel power components on the same rack, establishing firmware flash compatibility across standard execution cycles. This power delivery management enables predictable data throughput over Profinet and EtherNet/IP deterministic networks without risk of voltage dropouts during peak I/O density scaling spikes.
Frequently Asked Questions
Q: Does this power supply module support hot-swap replacement within an active rack?
A: No. Complete input power isolation is required before extracting or inserting the module. Removing the primary power source hardware while the backplane is energized can induce severe transient arc voltage faults, causing diagnostic software halts or physical component degradation across adjacent processing units.
Q: How is the load-sharing mechanism configured between dual power units?
A: Load sharing executes automatically when two identical modules occupy the same backplane framework. The hardware internally matches output impedance parameters, allowing balanced current distribution across the 5.1 VDC and 3.3 VDC rails to protect against single-point supply failures.
Field Installation Guidelines
- Mount the module exclusively in dedicated power slots on the far left of the rack assembly to optimize backplane voltage distribution.
- Terminate incoming AC or DC field supply lines using copper conductors rated for a minimum of 75 deg C, securing the terminal blocks to the specified torque limit.
- Connect a low-impedance external copper strap from the frame ground terminal directly to the central enclosure ground bus to dissipate high-frequency electrical noise.
- Maintain clear vertical spacing of 100 mm above and below the chassis to prevent thermal entrapment and ensure continuous passive cooling.
Return policy
We aim to provide reliable products and a smooth purchasing experience. If there is a problem with your order, please contact us and we will assist according to our Refund Policy.
Shipping
We provide international shipping options to meet different delivery requirements. Please review details regarding methods and timelines in our Shipping Policy.
Warranty
We provide a 12-month warranty for all products, subject to normal use and proper installation.
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