GE Fanuc IC694CHS392 Expansion Baseplates PACSystems RX3i

Product Overview

Configured for multi-module physical housing and parallel electrical bus distribution in PACSystems RX3i networks, the GE Fanuc IC694CHS392 (IC694CHS392 Expansion Baseplate) provides direct physical/electrical execution. The hardware establishes localized grounding reference structures, routes peripheral communication signals across standard backplane traces, and distributes isolated DC operating voltages to inserted I/O and specialty modules.

Hardware Specifications

Deterministic Network and Backplane Bus Performance

The baseplate layout implements a parallel signal track configuration to support standard backplane bus communication velocity across all active card slots. This physical layer enforces direct firmware flash compatibility lines for integrated Series 90-30 and RX3i processing hardware components. The grounding and shielding layout handles dense I/O configurations while allowing proper I/O density scaling options across complex processing chains linked over Profinet or EtherNet/IP deterministic networks.

Frequently Asked Questions

Q: Does the IC694CHS392 baseplate chassis allow the hot-swap extraction or insertion of standard I/O modules while energized?

A: No. The PACSystems RX3i expansion baseplate does not support hot-swapping. The power supply units connected to the expansion chain must be completely isolated before inserting or removing any module from the backplane slots to prevent electrical damage or communication bus failures.

Q: Can an RX3i PCI-based CPU module be installed directly into the IC694CHS392 baseplate slots?

A: No. The IC694CHS392 is an expansion baseplate designed with serial and legacy 90-30 parallel bus paths. It does not contain the high-speed PCI bus structure necessary to interface with primary RX3i PCI-based CPU modules, which require a main reference chassis.