GE Fanuc PACSystems RX3i IC694MDR390 Discrete Mixed l/O Module

Product Summary

The GE Fanuc IC694MDR390 is a discrete mixed input/output module engineered for the PACSystems RX3i platform. This high-density module features eight 24 VDC sinking or sourcing discrete inputs and eight isolated normally-open (NO) relay outputs housed within a single slot form factor. The module interfaces directly with standard industrial input sensors, switches, and field actuation components, processing steady-state digital logic data while providing dynamic electrical isolation between the backplane bus logic and field circuits.

Core Specifications

• Model: IC694MDR390
• Brand: GE Fanuc (Emerson)
• Product Type: Mixed Discrete Input/Output Module
• Series: PACSystems RX3i
• Origin: United States
• Weight: 0.36 kg
• Dimensions: 34 mm x 145 mm x 140 mm
• Number of Inputs: 8 points (1 group with shared common)
• Input Voltage Range: -30 to +32 VDC
• Input Current: 7.5 mA typical at 24 VDC
• Number of Outputs: 8 points (normally open relay, 2 groups of 4)
• Output Voltage Range: 5–30 VDC or 5–250 VAC, 50/60 Hz
• Output Current Rating: 2 A maximum per point; 4 A maximum per common
• Inrush Rating: 5.0 A maximum
• Galvanic Isolation: 1500 Vrms field-to-logic; 500 Vrms between output groups
• Input Response Time: 7 ms typical
• Output Response Time: ≤ 15 ms
• Internal Power Consumption: 80 mA @ 5 VDC (logic); 70 mA @ 24 VDC (relay)
• Operating Temperature: 0 to +60 deg C

Functional Features

• Combines discrete DC sensing and mechanical relay actuation into a compact single backplane slot allocation.
• Supports bidirectional logic configuration, operating as either a sinking or sourcing input layout via the user-common connection.
• Integrates firmware-driven I/O data scaling to accommodate high-velocity backplane bus communication across the RX3i chassis.
• Provides individual optical and galvanic status barriers to shield vulnerable core processor architectures from electromagnetic line noise.
• Equipped with 16 dedicated front-panel LED indicators displaying discrete real-time logic states for each independent input and output point.

Installation Notes

• Insert the module into any available I/O slot of an RX3i Universal Backplane.
• This component does not support hot-swap capabilities; the entire host RX3i backplane must be de-energized prior to structural insertion or physical module removal.
• External AC or DC power sources must be wired independently by the system installer to drive all connected field equipment, as the module contains no internal fusing.
• Maintain structured separation between low-voltage DC input signal runs and high-voltage AC inductive load wiring inside the routing conduits to maintain optimal signal integrity.
• Ensure field terminals are securely locked down to minimize electrical arc resistance and noise cross-talk over high-density deployments.

FAQ

• Does the IC694MDR390 support hot-swapping or live insertion?
  No. The module does not support insertion into or removal from an RX3i Universal Backplane while the system is under power. The rack power supply must be turned off before swapping the hardware.
• Are the inputs positive or negative logic configurations?
  The eight discrete 24 VDC inputs feature flexible characteristics. They can accept either positive or negative logic inputs because they can sink or source current to and from the connected field devices relative to the user common.
• What are the internal current draw requirements from the backplane rails?
  The module draws 80 mA from the internal 5 VDC logic bus and 70 mA from the 24 VDC relay power bus. System builders must include these values when calculating the power supply load parameters.