IC695CPU320 CPU Processors GE Fanuc PACSystems RX3i GE Fanuc

Configured for high-speed control logic processing in PACSystems RX3i rack architectures, the GE Fanuc IC695CPU320 (IC695CPU320 CPU Processor Module) provides direct physical/electrical execution.

Hardware Specifications

Deterministic Network Architecture and Firmware Flash Compatibility

The hardware platform utilizes an integrated high-performance processing block designed to handle complex distributed logic maps over Profinet / EtherNet/IP deterministic networks. The module interfaces directly with the dual-bus PACSystems RX3i backplane, which accommodates both high-speed PCI execution loops for high-density scaling and serial infrastructure tracks for legacy hardware profiles. This architecture optimizes backplane bus communication velocity and eliminates timing drift when manipulating complex data matrices. The internal memory allocation supports full firmware flash compatibility, enabling engineers to perform programmatic controller field upgrades via localized interfaces or remote Ethernet routing options while maintaining strict synchronization with local I/O expansion configurations.

Frequently Asked Questions

Q: What are the exact mechanical constraints and operational limits regarding hot-swapping the IC695CPU320 module?

A: The IC695CPU320 central processing unit does not support hot-swapping. The RX3i universal chassis assembly must be completely isolated from external power sources prior to inserting or extracting the CPU card. Live extraction disrupts the localized PCI backplane bus communication velocity and risks permanent hardware destruction due to inductive voltage transitions.

Q: How is the volatile memory sustained to prevent configuration losses during main line drops?

A: The module is equipped with a battery-backed RAM circuit that preserves the active logic program, symbolic variables, and hardware registration files during power transitions. For long-term zero-power storage, the execution program must be written directly into the non-volatile 64 MB flash memory bank using standard workstation software commands.

Field Installation Guidelines

• Chassis Attachment and Alignment: Slide the processor card into the designated CPU slot (Slot 1 or Slot 2) of the RX3i universal baseplate. Ensure that the plastic card edge matches the upper and lower guide tracks smoothly, and push firmly until the rear multi-pin interfaces latch completely into the backplane connectors.
• Chassis Grounding and Noise Shielding: Connect a heavy-gauge copper ground conductor from the primary RX3i chassis earth terminal lug directly to the central panel cabinet subplate to eliminate high-frequency common-mode electromagnetic noise interference.
• Thermal Space Requirements: Maintain a minimum physical spacing gap of 102 mm above and below the baseplate frame layout to allow non-obstructed passive convective air flow to escape from the integrated ventilation slits.
• Serial Link Shield Termination: When wiring the integrated RS-485 or RS-232 communication interfaces, connect the outer braided cable shield exclusively to the grounding shell of the industrial connector block to prevent ground-loop current injections.