IC697ACC724 Series 90-70 Blank Slot Filler Module GE Fanuc

Product Overview

The GE Fanuc IC697ACC724 serves as the primary IC697ACC724 Blank Slot Filler Module utilized to execute physical rack space management across Series 90-70 platforms. This structural component seals unpopulated slots within standard 90-70 chassis enclosures, forming an uninterrupted front barrier across the card cage. It establishes proper internal convective airflow vectors and prevents foreign particulate contamination from accumulating directly onto the exposed circuits of active backplane channels.

Hardware Specifications

Cooling Optimization and I/O Density Scaling

The installation of this double-width structural module regulates internal thermal pressure profiles during extensive I/O density scaling adjustments. When a double-slot gap remains unsealed, the open area alters vertical thermal convection paths, causing forced cooling air to bypass adjacent microprocessors. Inserting this block maintains designed internal static pressure constraints, preventing localized hotspots on surrounding high-performance modules and ensuring uninterrupted firmware flash compatibility across the active hardware backplane.

Frequently Asked Questions

Q: Does this component draw logic current from the 5 VDC backplane pins or generate any thermal output?

A: No. The assembly is entirely passive and mechanical, containing no circuit boards, internal logic wiring, or physical backplane connectors. It draws zero milliamperes from the power supply bus.

Q: Is it permissible to remove or insert this filler module while the Series 90-70 rack remains energized?

A: Yes. Because the component features no electrical conductor interfaces or signal pathways, physical manipulation of this mechanical plate does not generate electrical noise or disrupt live backplane bus communication cycles.

Field Installation Guidelines

• Chassis Alignment: Position the upper and lower injection-molded alignment guides of the filler module into the corresponding slot tracks of the empty double-width chassis space.
• Mechanical Seating: Slide the module backward into the card cage until the front faceplate lines up flush with adjacent units. Hand-tighten the top and bottom retention screws directly into the rack frame to prevent vibration displacement.
• Thermal Maintenance: Ensure all unused slot positions inside the chassis are occupied by single or double-width filler plates to prevent ambient air bypass and safeguard components against unattenuated electrostatic discharge.