Skip to product information
Mark VIe Relay Output Terminal Board | IS230TRLSH2B GE

GE Fanuc

Mark VIe Relay Output Terminal Board | IS230TRLSH2B GE

10 left
  • Manufacturer: GE Fanuc

  • Product No.: IS230TRLSH2B

  • Product Type: Mark VIe Relay Output Terminal Board

  • Product Origin: USA

  • Payment:T/T, Western Union

  • Weight: 1000g

  • Shipping port: Xiamen

  • Warranty: 12 months

Special offer ends!
00 :
00 :
00

Product Overview

The GE IS230TRLSH2B operates as a high-density relay output terminal board within the General Electric Mark VIe Speedtronic turbine control platform. This specialized physical layer module mates natively with discrete output I/O packs to control critical plant actuation equipment, including heavy-duty solenoids, interposing relays, motor starters, and visual indicator panels. It accepts digital commands from the control network and drives rugged on-board mechanical relays to break or establish field-side power loops. By separating vulnerable solid-state processor components from high-power external field voltages, this board acts as a safety-critical barrier that guarantees precise, isolated signal switching across power generation assets.

We distribute this high-performance asset exclusively as 100% brand new, original factory-sealed stock to guarantee clean terminal connections, reliable relay contact life, and zero field defects.

Technical Specifications

The IS230TRLSH2B integrates multiple independent electromechanical or solid-state relay channels alongside terminal block clusters on a ruggedized baseplate. The table below outlines the core electrical, physical, and environmental baseline specifications:

Parameter Specification Details
Manufacturer General Electric (GE)
Part Number IS230TRLSH2B
Control Platform Mark VIe Speedtronic System
Functional Group TRLS (Standard Relay Output Terminal Board with Solenoid Sync)
Hardware Revision H2B (Designates specific high-density channel grouping)
Channel Count High-density independent relay output channels
Contact Configuration Form-C (Normally Open / Normally Closed dry contacts)
Interface Mating Heavy-duty D-sub connectors for direct I/O pack attachment
Voltage Isolation 1500 V AC galvanic isolation between control logic and field terminals
Operating Temperature -30°C to +65°C (-22°F to +149°F)
Humidity Boundaries 5% to 95% relative humidity, non-condensing parameters

Engineering Advantages

  • High-Density Space Optimization: The structural layout condenses multiple relay channels onto a single narrow footprint. This vertical design saves significant horizontal backpanel space inside automation cabinets, allowing engineers to wire complex multi-point trip loops without adding expansion enclosures.

  • Transient Overvoltage Isolation Protection: Heavy-duty opto-isolators and onboard surge suppression circuits shield the internal logic pathways from induction kickbacks and voltage surges. When a high-power field solenoid drops its inductive load, this protective layer blocks the destructive electrical noise from bleeding back into primary processor packs.

  • Direct-Fit I/O Pack Mounting: The mechanical baseplate features pre-aligned standoffs and high-density D-sub plugs. This architecture allows technicians to plug compatible Mark VIe discrete output packs (such as the PDOA or YDOA series) directly onto the board, eliminating interposing panel jumpers and reducing wiring labor.

  • Severe Environment Chemical Shielding: A durable conformal coating covers all internal copper traces and surface-mount components. This layer prevents moisture oxidation, salt-air corrosion, and conductive dust accumulation from creating short-circuits in harsh balance-of-plant or offshore locations.

FAQs

  • What structural updates does the 'H2B' suffix revision incorporate over older 'H1A' models?

    The "H2B" revision indicates an optimized component layout featuring upgraded relay contacts with higher thermal tolerance and superior contact ratings. It preserves drop-in physical placement compatibility, letting you replace older "TRLS" iterations without updating your existing cabinet wiring layout.

  • Q1: Can I perform a hot-swap on an I/O pack mounted to this terminal board while under power?

    A1: Yes. The structural design of the IS230TRLSH2B allows you to unbolt and swap out a faulted I/O pack while live, provided your system runs a redundant or Triple Modular Redundant (TMR) control loop configuration. You do not need to power down the terminal board or disconnect the field wiring terminals.

  • Q2: Does this board support inductive AC voltage switching natively?

    A2: Yes, the dry relay contacts handle both DC and AC voltage loads. However, when driving highly inductive AC field devices like large mechanical solenoid valves, you must install external snubbers or varistors across the field device to prevent premature relay contact pitting from electrical arcing.

  • Q3: How do I verify a channel failure without disconnecting field wiring?

    A3: The associated Mark VIe I/O pack reads real-time loop-back voltage feedback directly through the IS230TRLSH2B interface pins. If a field wire breaks or a relay contact fails to close during an execution command, the system triggers an immediate diagnostic alarm flag inside the ControlST interface.

Return policy

​We aim to provide reliable products and a smooth purchasing experience. If there is a problem with your order, please contact us and we will assist according to our Refund Policy.

Shipping

We provide international shipping options to meet different delivery requirements. Please review details regarding methods and timelines in our Shipping Policy.

Warranty

We provide a 12-month warranty for all products, subject to normal use and proper installation.

You may also like