Schneider
Schneider Electric TSXSUP702 AC Power Supply Module
Manufacturer: Schneider
Product No.: TSXSUP702
Product Type: AC Power Supply Module
Product Origin: France
Payment:T/T, Western Union
Weight: 2600g
Shipping port: Xiamen
Warranty: 12 months
Product Description
TSXSUP702 (Part Number: TSXSUP702) is a 70 W AC power supply for the Modicon TSX Micro PLC series. It converts industrial AC mains power into regulated DC voltages to power the CPU and I/O modules. Designed for high-density I/O systems, it ensures stable operation and protects against voltage fluctuations.
The module features wide-range input, internal protection circuitry, and efficient thermal management, making it suitable for demanding industrial environments.
Technical Specifications
| Feature | Specification |
|---|---|
| Input Voltage | 100–240 V AC |
| Frequency | 50/60 Hz |
| Power Rating | 70 W total output |
| Compatibility | Modicon TSX Micro PLC series |
| Protection | Internal fuse, short-circuit, overload, and overvoltage protection |
| Isolation | High dielectric strength between input and output |
| Status Indicators | LED diagnostics for input and output |
| Dimensions | 80 × 230 × 230 mm |
| Net Weight | 2.6 kg |
Applications
-
Standalone machine control
-
Material handling systems
-
Assembly line automation
-
High-density TSX Micro installations requiring stable, high-wattage DC
Notes
-
AC input only; DC input requires a different TSXSUP model
-
Memory backup handled by separate CPU battery
-
Field sensors: external 24 V DC supply recommended to avoid electrical noise
Return policy
We aim to provide reliable products and a smooth purchasing experience. If there is a problem with your order, please contact us and we will assist according to our Refund Policy.
Shipping
We provide international shipping options to meet different delivery requirements. Please review details regarding methods and timelines in our Shipping Policy.
Warranty
We provide a 12-month warranty for all products, subject to normal use and proper installation.
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